| abstract |
Disclosed are an adhesive having excellent adhesion to an oxide film and heat dissipation, and a bonded structure using the same. The adhesive contains an epoxy compound, a cationic catalyst, and an acrylic resin containing acrylic acid and an acrylic acid ester having a hydroxyl group. Acrylic acid in the acrylic resin reacts with the epoxy compound to generate a connection between Fig. 13 of the acrylic resin and the solution 12 of the epoxy compound, and roughens the surface of the oxide film 11a, causing the solution of the epoxy compound (12) ), while strengthening the anchor effect with, by melting the contained solder particles (1), a metal bond is formed between the electrode (10), and the adhesive force between the adhesive and the electrode (10) is increased, and the metal bonding surface It is possible to further improve the heat dissipation characteristics from |