| abstract |
A mold underfill material for compression molding that encapsulates a semiconductor element disposed on a substrate and fills a gap between the substrate and the semiconductor element, an epoxy resin (A), a curing agent (B), and an inorganic filler ( Including C), it is a powder and granular material, and when measured under the conditions of a mold temperature of 175° C. using a curastometer, the time T(5) from the start of the measurement to reaching 5% of the maximum torque is 25 seconds greater than or equal to 100 seconds. |