http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102357727-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-54453 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-54413 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-5442 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-54406 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-044 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-544 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02024 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1409 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00 |
| filingDate | 2020-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2022-02-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2022-02-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-102357727-B1 |
| titleOfInvention | Polishing composition for resolving ridges around laser marks containing positive ions |
| abstract | [Problem] To provide a polishing composition for removing the ridges around a laser mark in a wafer polishing process, a manufacturing method thereof, and a polishing method using the polishing composition. [Solution] A polishing composition comprising silica particles and water, the polishing composition further comprising tetraalkylammonium ions in a mass ratio of 0.400 to 1.500:1 with respect to SiO 2 of the silica particles, the polishing composition It is a polishing composition, characterized in that it contains SiO 2 dissolved in the silica particles in a mass ratio of 0.100 to 1.500:1 with respect to SiO 2 of the silica particles. The tetraalkylammonium ion is derived from a compound selected from the group consisting of alkali silicates, hydroxides, carbonates, sulfates and halides, and is contained in the polishing composition in a proportion of 0.2% by mass to 8.0% by mass. The dissolved SiO 2 is derived from tetraalkylammonium silicate, potassium silicate, sodium silicate, or a mixture thereof. |
| priorityDate | 2019-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 98.