http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102357446-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-028 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0045 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0751 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-245 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0758 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-075 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0382 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-038 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-075 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-028 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
| filingDate | 2015-06-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2022-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2022-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-102357446-B1 |
| titleOfInvention | Photosensitive resin composition, resist laminate, cured product of photosensitive resin composition, and cured product of resist laminate (11) |
| abstract | The present invention relates to a resin composition and/or a laminate thereof having a very low residual stress of the cured product and excellent adhesion to a metal substrate such as Pt, LT, and Ta after a wet heat test, and/or a laminate thereof in a semiconductor or MEMS/micromachine application field, and It aims at providing the hardened|cured material. The present invention is a photosensitive resin composition containing (A) an epoxy resin, (B) a compound having a phenolic hydroxyl group, and (C) a photocationic polymerization initiator, wherein (A) the weighted average epoxy equivalent of the epoxy resin is 300 g/ eq. It is more than, and 20 mass % or more of the (A) epoxy resin is following formula (1) , and the epoxy equivalent is 500 to 4500 g/eq. It is a phosphorus epoxy resin, and the compound which has this (B) phenolic hydroxyl group is the photosensitive resin composition containing the phenol compound of a specific structure. |
| priorityDate | 2014-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 139.