http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102354146-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J4-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J5-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06F3-041 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-323 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J4-00 |
| filingDate | 2015-01-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2022-01-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2022-01-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-102354146-B1 |
| titleOfInvention | Method for producing connection structure, and circuit connecting material |
| abstract | The present invention provides a method for manufacturing a bonded structure capable of maintaining life and capable of low-temperature crimping, and a circuit connection material. A circuit connection comprising: an arrangement step of arranging the first circuit member and the second circuit member with a circuit connection material interposed therebetween; and a crimping step of thermocompressing the first circuit member and the second circuit member at a predetermined temperature to obtain a connection structure; A material contains a radically polymerizable compound, the organic peroxide which is higher than the said predetermined temperature, and has a half-life temperature of +20 degrees C or less for 1 minute of the said predetermined temperature, a secondary thiol compound, and electroconductive particle. |
| priorityDate | 2014-02-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 66.