http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102352497-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J3-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49894 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K7-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-147 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-145 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J3-12 |
| filingDate | 2017-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2022-01-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2022-01-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-102352497-B1 |
| titleOfInvention | Thermosetting resin composition, resin encapsulating substrate and electronic device |
| abstract | Provided is a thermosetting resin composition capable of suppressing position shift due to thermal history. The thermosetting resin composition of this invention is a thermosetting resin composition used for formation of a resin-encapsulation board|substrate, Comprising: It is a thermosetting resin composition which satisfy|fills the following condition 1. (Condition 1) After obtaining the cured product of the thermosetting resin composition by transfer molding (175° C., 120 seconds), the cured product was subjected to a first heat treatment (175° C., 4 hours) at 25° C. with respect to the mold size of the cured product. S 1 (%) as the shrinkage in the cured product, and the second heat treatment (time at 190 ° C. is t 1 , and after raising the temperature from 190 ° C. to 233 ± 3 ° C., 190 When the time at which the temperature was lowered to ℃ is t2, t2-t1 satisfies 100±50 seconds), the third heat treatment (125°C, 2 hours), the fourth heat treatment (175°C, 6 hours) in the order When the shrinkage rate at 25°C with respect to the die size of the cured product after treatment is S 4 (%), the following expression is satisfied. 0.85×S 1 ≤S 4 ≤1.15×S 1 (1-1) |
| priorityDate | 2016-09-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 102.