http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102347589-B1

Outgoing Links

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-521
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-521
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18
filingDate 2019-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2022-01-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2022-01-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-102347589-B1
titleOfInvention Low Dielectric Polyimide Film and Manufacturing Method Thereof
abstract The present invention relates to a low-k polyimide film having a reduced number of bubbles and a method for manufacturing a polyimide film comprising the same, comprising biphenyltetracarboxylic dianhydride (BPDA) and pyromellitic dianhydride (PMDA) It is obtained by imidizing a polyamic acid solution containing a dianhydride component and a diamine component including oxydianiline (ODA), paraphenylene diamine (PPD) and m-tolidine, and phosphorus-based A polyimide film comprising the compound is provided.
priorityDate 2019-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 44.