| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G2261-76
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-024
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-0025 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-315
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4284
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-58
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4676 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 |
| filingDate |
2021-07-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2021-12-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2021-12-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-102345110-B1 |
| titleOfInvention |
Resin composition for printed circuit board, resin varnish using the same, adhesive film, prepreg and printed wiring board |
| abstract |
The present invention is an epoxy resin; an active ester (AE) curing agent reacting with the epoxy resin; And cyanate ester (cyanate ester, CE) curing agent; relates to a resin composition for a printed circuit board comprising a. |
| priorityDate |
2015-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |