http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102344987-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83191 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32145 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45147 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45124 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-27 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301 |
| filingDate | 2014-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-12-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-12-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-102344987-B1 |
| titleOfInvention | Dicing·die bond film, manufacturing method for semiconductor device, and semiconductor device |
| abstract | The present invention is to provide a dicing die-bonding film capable of performing desired dicing even with an embedding adhesive film, a method for manufacturing a semiconductor device using the dicing die-bonding film, and a semiconductor device obtained by the manufacturing method. The present invention is a dicing die-bonding film comprising a dicing film having a substrate and a pressure-sensitive adhesive layer formed on the substrate, and an adhesive film laminated on the pressure-sensitive adhesive layer, the adhesive film comprising: a first semiconductor fixed on an adherend An adhesive film for embedding an element and for fixing a second semiconductor element different from the first semiconductor element to an adherend, wherein the peeling force between the adhesive film and the pressure-sensitive adhesive layer is 0.03N/20mm or more and 0.2N/20mm These are the following dicing die-bonding films. |
| priorityDate | 2013-12-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 179.