| abstract |
An anisotropic conductive adhesive having excellent optical properties and heat dissipation properties is provided. Electroconductive particles 31 in which a metal layer containing Ag as a main component is formed on the outermost surface of the resin particles, solder particles 32 having an average particle diameter smaller than that of the conductive particles, light reflective insulating particles having an average particle diameter smaller than that of the solder particles, and conductive particles (31), the solder particles (32), and a binder for dispersing the light reflective insulating particles. Electroconductive particles and light reflective insulating particles efficiently reflect light, improving the light extraction efficiency of the LED mounting body. Further, since the solder particles 32 solder the terminals together at the time of crimping, the contact area between the opposing terminals increases, and high heat dissipation characteristics are obtained. |