| titleOfInvention |
Adhesive, film-shaped adhesive material, adhesive layer, adhesive sheet, copper foil with resin, copper clad laminate, printed wiring board, and multi-layer board and manufacturing method thereof |
| abstract |
<task> An object of the present invention is to provide an adhesive, a film adhesive, an adhesive layer, an adhesive sheet, a copper foil with resin, a copper-clad laminate, a printed wiring board, a multilayer wiring board, and a method for manufacturing the same. <Solutions> A high softening point polyimide with a softening point of 140° C. or higher, a low softening point polyimide with a softening point of 100° C. or less, an adhesive containing a crosslinking agent, a film adhesive, an adhesive layer, an adhesive sheet, a resin coated copper foil, a copper clad laminate, a printed wiring board, and a multilayer wiring board; It is taken as a solution means to provide the manufacturing method. |