http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102326028-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-3245 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-265 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D3-2075 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-3209 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D1-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D3-3956 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D3-3947 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D3-042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02057 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D11-0047 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D3-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D1-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D3-20 |
| filingDate | 2015-01-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-102326028-B1 |
| titleOfInvention | Cleaner Composition for Process of Manufacturing Semiconductor and Display |
| abstract | An embodiment of the present invention relates to a cleaning composition for a semiconductor and display manufacturing process, and the cleaning composition according to the present invention is an acid-based aqueous acid system having a pH of 1 to 5, 0.01 to 5.0 wt% of an amino acid-based chelating agent; 0.01 to 1.5 wt% organic acid; 0.01 to 1.0 wt% of inorganic acid; It contains 0.01 to 5.0 wt% of a basic compound and the remaining ultrapure water (DI water), and the cleaning composition of such a composition improves the ability to remove metal impurities, thereby removing particles and organic contaminants, and with it, copper corrosion and It can perform all functions to prevent reverse adsorption, and accordingly, it can be used for various purposes of etching for copper, removing residues, and cleaning agents through adjustment of the etch rate. |
| priorityDate | 2015-01-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 65.