http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102311193-B1

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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30625
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14
filingDate 2014-04-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2021-10-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2021-10-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-102311193-B1
titleOfInvention A stable, concentratable silicon wafer polishing composition and related methods
abstract The present invention is water; abrasive; cations according to formula (I); and piperazine or a piperazine derivative according to formula (II); and, optionally, a pH adjusting agent, wherein the composition exhibits a silicon removal rate of at least 300 nm/min. The present invention also provides methods of making and using stable and condensable chemical/mechanical polishing compositions.
priorityDate 2013-04-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 37.