| abstract |
A layer containing at least tungsten and a means for suppressing the dissolution rate of tungsten while sufficiently removing impurities remaining on the surface of a polished object having tetraethyl orthosilicate or silicon nitride is provided. A high molecular compound having a sulfonic acid (salt) group, at least one compound selected from amino acids and polyols, a dispersion medium, a layer containing at least tungsten, and tetraethyl orthosilicate or silicon nitride. A surface treatment composition used to treat a surface. |