http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102302184-B1

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filingDate 2018-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2021-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2021-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-102302184-B1
titleOfInvention Copper Film With Dimensional Stability And Texture Stability At High Temperature, And Manufacturing Methods Thereof
abstract The present invention relates to an electrodeposited copper foil having high dimensional stability and texture stability in a high-temperature environment in a Li secondary battery manufacturing process, and a method for manufacturing the same. In the electrodeposited copper foil having a first surface and the second surface, the electrodeposited copper foil has a thermal expansion coefficient of 17.1 to 22 μm/(m ·° C.) in a temperature range of 30° C. to 190° C., X before and after heat treatment at 190° C. for 30 minutes It provides an electrodeposited copper foil, characterized in that the half-width variation with respect to the (220) peak of the line diffraction pattern is in the range of 0.81 to 1.19. According to the present invention, it is possible to provide an electrodeposited copper foil that reduces the possibility of wrinkles and/or tears occurring in a subsequent secondary battery manufacturing environment by controlling the physical properties of the electrodeposited copper foil in the manufacturing process of the electrodeposited copper foil.
priorityDate 2018-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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