| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-2227 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-013 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22 |
| filingDate |
2019-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2021-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2021-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-102298511-B1 |
| titleOfInvention |
Heat dissipation adhesive composition |
| abstract |
The present invention relates to a heat-dissipating adhesive composition having excellent thermal conductivity and insulating properties, and the heat-dissipating adhesive composition of the present invention includes a thermally conductive filler and a polymer containing aluminum oxide having a purity of 99.9% or more. |
| priorityDate |
2019-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |