| Predicate |
Object |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-86
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67132
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67121
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67712
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-68721
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-68742
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67259 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-687
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-677
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-67
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 |
| filingDate |
2019-09-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2021-09-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2021-09-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-102297846-B1 |
| titleOfInvention |
Die bonding apparatus and manufacturing method of semiconductor device |
| abstract |
An object of the present invention is to provide a die bonding apparatus that automatically confirms pick-up properties and collet inclination (tilting). A die-bonding apparatus is provided with the pushing-up unit which pushes up the die|dye from the bottom and peels it from a dicing tape, and the die-bonding part which adsorb|sucks the peeled said die|dye and bonds it on a board|substrate. The push-up unit includes a push-up jig and a housing in which the push-up jig is installed. Instead of the push-up jig, a measuring jig can be installed in the housing and detached from the housing. The push-up jig has a block for pushing up the dicing tape in a dome. The measuring jig is accommodated in the measuring device in the dome. |
| priorityDate |
2018-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |