A resin composition, a prepreg, a resin sheet, a laminated resin sheet, a laminated board, a metal foil clad laminated board, and a printed wiring board
It contains a cyanate ester compound (A) and a maleimide compound (B), and the amount of cyanate ester groups (α) of the cyanate ester compound (A) with respect to the amount of maleimide groups (β) of the maleimide compound (B) ) ratio ([α/β]) is 0.30 or more, the resin composition.