| abstract |
A resin composition comprising (A) a polyimide resin containing 60 mol% or more of a diamine residue having a structure represented by the following general formula (1), (B) a thermosetting resin and (C) a thermally conductive filler, , (A) A resin composition containing 60 parts by volume or more of (C) a thermally conductive filler with respect to a total of 100 parts by volume of the polyimide resin, (B) thermosetting resin, and (C) thermally conductive filler. Provided is a resin composition capable of obtaining a sheet having excellent heat resistance and thermal conductivity, a low elastic modulus, and excellent thermal responsiveness. |