http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102285047-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J179-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J179-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-22 |
| filingDate | 2015-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-08-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-08-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-102285047-B1 |
| titleOfInvention | Polycarbonate-imide-based resin paste, and electronic component having solder resist layer, surface protective layer, interlayer dielectric layer, or adhesive layer each obtained by curing said paste |
| abstract | (1) solubility in non-nitrogen solvents, (2) low-temperature drying/curing properties, (3) low warpage, (4) flexibility, (5) printing properties, (6) excellent alkali resistance, heat resistance, chemical resistance, electrical properties To provide an electronic component having this excellent polycarbonate imide-based resin paste and a solder resist layer obtained by curing the paste, a surface protective layer or an adhesive layer. (A) As a component, (a) a trivalent and/or tetravalent polycarboxylic acid derivative having an acid anhydride group, (b) an acid dianhydride having a polycarbonate skeleton of a specific structure, and (c) an isocyanate compound or an amine compound are essential A polycarbonate imide resin paste comprising a polycarbonate imide resin as a copolymerization component, an epoxy resin having two or more epoxy groups per molecule as component (B), and a filler as component (C). |
| priorityDate | 2014-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 235.