http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102275360-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-54 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-54 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-62 |
| filingDate | 2019-01-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-07-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-07-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-102275360-B1 |
| titleOfInvention | Light emitting device |
| abstract | The present disclosure provides a semiconductor light emitting chip having a flip structure including electrodes; a mold having a bottom portion placed under the flip-structured semiconductor light emitting chip so as to face the electrode and having a plurality of holes formed in the bottom portion corresponding to the electrode; a lead frame integrally formed with the mold and exposed through a plurality of holes; And, it relates to a semiconductor light emitting device to which a flip chip is applied, including a conductive part provided in each of the plurality of holes for electrical communication between the electrode and the lead frame, at least a part of which is made of solder. |
| priorityDate | 2019-01-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 27.