abstract |
Methods for seamless gap filling include forming a flowable film by PECVD; treating the flowable film to form a Si—X film, wherein X is C, O, or N; and curing the flowable film or Si-X film to solidify the film. Flowable films can be formed using higher order silanes and plasmas. To coagulate the flowable or Si-X film, UV curing or other curing may be used. |