http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102268410-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0323 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0271 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10416 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0204 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-367 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3737 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3736 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0206 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0271 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-02 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-367 |
| filingDate | 2017-12-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-102268410-B1 |
| titleOfInvention | Heat dissipation substrate, heat dissipation circuit structure, and manufacturing method thereof |
| abstract | Provided are a heat dissipation substrate and a heat dissipation circuit structure capable of ensuring stable adhesion while reducing cost, and a method for manufacturing the same. A base substrate having a first surface and a second surface, a conductive path formed on the first surface, a through hole penetrating from the first surface to the second surface, and insertion into the through hole and a gap between the heat dissipating member at least partially protruding from the first surface, and the inner circumferential surface of the through hole and the outer circumferential surface of the heat dissipating member that covers the side surface of the heat dissipation member and is surrounded by the inner circumferential surface A heat dissipation substrate comprising a thermally conductive resin composition interposed therebetween and a metal layer covering the heat dissipating member protruding from the first surface, wherein the outer surface of the metal layer and the outer surface of the conductive path are substantially on the same plane. . |
| priorityDate | 2016-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 52.