http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102267793-B1

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filingDate 2021-01-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2021-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_363ebbb49c4c80119f0b18afc33766d8
publicationDate 2021-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-102267793-B1
titleOfInvention Inorganic material color-chip and construction method of building flooring used the same
abstract The present invention relates to an inorganic color chip and a building flooring construction method using the same, wherein the inorganic color chip comprises: 80 to 85% by weight of calcium carbonate; 10 to 15% by weight of any one or more water-soluble binders selected from polyvinyl acetate (PVA) and polyacrylic ester having a solid content of 40 to 60% by weight; 1 to 10% by weight of inorganic pigments; The mixed raw material is molded into a film with a thickness of 50 to 300 μm between a pair of rollers, dried and crushed to form a particle size of less than 1 mm 1 to 5%, a particle size of 1 to 5 mm 90 ~ 95%, it is characterized in that it is blended in a ratio of 1 to 5% with a particle size exceeding 5 mm. In addition, the building flooring construction method using the inorganic color chip includes a pretreatment step (S1) of removing foreign substances by grinding the surface of the concrete flooring material; an undercoating process (S2) of applying an epoxy primer to a thickness of 0.2 to 0.5 mm on the concrete flooring and drying it to improve adhesion to the surface of the flooring; A primary intermediate treatment step (S3) of applying a solvent-free epoxy coating to a thickness of 1±0.2 mm on the cured undercoat to strengthen the adhesion between the interfaces; Silica sand having a particle size of 20 to 60 mesh is sprayed on the solvent-free epoxy coating agent, dried at room temperature for 12 to 48 hours to attach silica sand, and then unattached silica sand is removed to improve the smoothness of the flooring and resistance to cracks. processing step (S4); A second intermediate treatment step (S5) of applying a transparent solvent-free epoxy coating to a thickness of 1±0.2 mm on the first intermediate coating film that is attached to the silica sand and hardened to strengthen the adhesiveness between the interfaces (S5); Inorganic color chip treatment process (S6) of spraying inorganic color chips with a single color or a combination of two or more colors on the transparent solvent-free epoxy coating, drying at room temperature for 12 to 48 hours, attaching the color chips, and scraping off the unattached color chips (S6) ); A topcoating process (S7) of applying a transparent solvent-free epoxy coating to a thickness of 0.5 to 0.8 mm on the second intermediate coat layer to which the inorganic color chip is attached and cured, and drying the inorganic color chip at room temperature for 12 to 48 hours (S7); A hybrid coating process (S8) of applying an organic-inorganic composite coating to a thickness of 0.2 to 0.3 mm on the top coat and drying at room temperature for 12 to 48 hours to enhance durability and flame retardancy of the flooring is included.
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