| abstract |
[Problem] Provision of a method for manufacturing a printed wiring board without curing unevenness or the like even when the resin composition layer is thermosetted to form an insulating layer with the support attached thereto. [Solution means] (A) a step of preparing an adhesive sheet comprising a support body and a resin composition layer formed on the support body, (B) a step of laminating the resin composition layer on the inner layer substrate so that it is bonded to the inner layer substrate, and (C) a step of thermosetting the adhesive sheet by heating from T1 (°C) to T2 (°C) to form an insulating layer, the maximum expansion rate of the support in the MD direction when heating from T1 (°C) to T2 (°C); , the sum of the difference between the expansion rate of the support at the end of heating, the maximum expansion rate of the support in the TD direction when heating from T1 (°C) to T2 (°C), and the difference between the expansion rate of the support at the end of heating When X and the minimum melt viscosity of the resin composition layer in 120 degreeC or more are made into Y, it is thermosetted so that the relationship of Y>2700X may be satisfied. |