| abstract |
A silicone skeleton-containing polymer compound having a repeating unit represented by the following general formula (1) and having a weight average molecular weight of 3,000 to 500,000. (X is an organic group represented by the general formula (2), Y is an organic group represented by the general formula (3), and W is an organic group represented by the general formula (4).) According to the present invention, it is possible to provide a chemically amplified negative resist material capable of remarkably improving the problem of peeling encountered on metal wirings such as Cu or Al, electrodes, and substrates, particularly on substrates such as SiN. |