http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102260856-B1
Outgoing Links
Predicate | Object |
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classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01P2004-62 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01J6-001 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01B33-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L101-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01J8-08 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C01B33-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B01J8-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B01J6-00 |
filingDate | 2014-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2021-06-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2021-06-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | KR-102260856-B1 |
titleOfInvention | Method for producing crushed silica particles, and resin composition containing said particles |
abstract | The silica particles calcined in the calcination step are supplied and pulverized in the swirling flow generated by the gas introduced into the pulverization container. Thereby, disintegration becomes possible easily, and disintegration silica particle which is compatible with low hygroscopicity and high resin dispersibility is implement|achieved. In addition, when dehumidifying air (gas) is introduced at the time of disintegration, the hygroscopicity is lowered and the dispersibility to the resin is greatly improved. In addition, if heat treatment (calcination) is performed again after disintegration, the surface of the disintegrated silica particles is modified to significantly improve hygroscopicity and dispersibility in resin. The resin composition containing the disintegrated silica particles thus obtained has good injectability and filterability when used as an underfill material for semiconductors, in-plane spacers or sealing spacers for liquid crystal display devices. |
priorityDate | 2013-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 103.