Predicate |
Object |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D5-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D5-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-552 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K9-0083 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D5-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K9-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D163-00 |
filingDate |
2014-04-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2021-06-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate |
2021-06-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-102260343-B1 |
titleOfInvention |
Emi shielding composition and process for applying it |
abstract |
The present invention relates to an EMI shielding composition comprising a thermoplastic and/or thermosetting resin, a solvent or reactive diluent and conductive particles, which provides a uniform and homogeneous thickness to the EMI shielding layer. The present invention also provides a method of applying an EMI shielding layer over an encapsulant protecting a CI device component. |
priorityDate |
2014-04-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |