http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102257128-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0306 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-187 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-40 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-40 |
| filingDate | 2020-02-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-102257128-B1 |
| titleOfInvention | Electroless copper plating bath |
| abstract | The electroless copper plating bath is an electroless copper plating bath having a pH of 5 to 10 that contains a hydrazine compound as a reducing agent and does not contain formaldehyde, and contains at least an amine-based complexing agent or an amine compound, and an aminocarboxylic acid-based complexing agent. |
| priorityDate | 2019-07-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 92.