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publicationDate 2021-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-102257116-B1
titleOfInvention Laminated heat sink with improved thermal conductivity
abstract The present invention relates to a laminated heat sink with improved thermal conductivity, and the present invention relates to an adhesive composition for a heat sink including an epoxy resin, a curing agent, a heat radiation filler, and a heat radiation bead, and a heat sink module using the same.
priorityDate 2021-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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