| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0723
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1492
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0307 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-246
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-611
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-627
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-241
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-12 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 |
| filingDate |
2014-05-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2021-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2021-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-102254080-B1 |
| titleOfInvention |
Method for depositing thick copper layers onto sintered materials |
| abstract |
The present invention relates to a method for electrodepositing a thick copper layer on an electrically conductive sintered layer. The thick copper layer has high adhesion strength, few defects and internal stress, and has high electrical and thermal conductivity. The thick copper layer on the sintered layer is suitable for printed circuit boards for high power electronic applications. |
| priorityDate |
2013-05-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |