http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102253017-B1

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filingDate 2011-10-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2021-05-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2021-05-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-102253017-B1
titleOfInvention Laser processing systems and methods for beam dithering and skiving
abstract The laser processing system includes a first positioning system for giving a first relative motion of a beam path along a beam trajectory with respect to a work piece, a processor for determining a second relative motion of the beam path along a plurality of dither rows, and the second A second positioning system that imparts relative motion, and a laser source that emits laser beam pulses. The system can compensate for variations in processing speed to keep the dither row at a predetermined angle. For example, dither rows can be held perpendicular to the beam trajectory regardless of processing speed. The processing speed can be adjusted to process an integer number of dither rows to complete the trench. The number of dither points in each row can be selected based on the width of the trench. The fluence can be normalized by adjusting the processing speed and the change in trench width.
priorityDate 2010-10-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 29.