| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83862
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83874
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83224
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29388
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29369
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29K2101-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-8322
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80855
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81191
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-75283
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-8323
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29439
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83871
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83868
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29364
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29309
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29313
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29347
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81903
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24752
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29386
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29339
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29344
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29L2009-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-2929
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29393
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29499
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C65-221
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C65-245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-83
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-345
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05B3-0038
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C65-4835
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C65-1403 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-34 |
| filingDate |
2013-12-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2021-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2021-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-102244094-B1 |
| titleOfInvention |
Curing a heat-curable material in an embedded curing zone |
| abstract |
The present invention relates to a method for curing a thermosetting material 1 in an embedded cured region 2 and an assembly obtained therefrom. The method comprises providing a thermally conductive strip 3 which is partially arranged between the substrate 10 and the component 9 forming the embedded cured region 2 therebetween. The thermally conductive strip (3) extends from the embedded cured area (2) to a radiation accessible area (7) spaced from the embedded curing area (2) and at least partially free of the component (9) and the substrate (10). Is extended. The method also includes the step of irradiating the thermally conductive strip 3 in the radiation accessible area 7 with electromagnetic radiation 6. The heat 4a generated by the absorption of the electromagnetic radiation 6 in the thermally conductive strip 3 is from the radiation accessible area 7 along the length of the thermally conductive strip 3 to the embedded cured area The thermosetting material 1 is cured by conduction heat 4b which is conducted to (2) and radiated from the thermally conductive strip 3 to the embedded curing region 2. |
| priorityDate |
2012-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |