| abstract |
Polyurethane resin composition having high adhesion to various plastic films and metals, high moisture and heat resistance that can cope with soldering after humidification, and excellent flame retardancy without using halogen or antimony, and adhesive compositions, laminates, and printed wiring boards using the same. To provide. A polyurethane resin composition containing a polyurethane resin (A) and an epoxy resin (B) satisfying the following (1) to (3): (1) A polyester polyol containing a phosphorus compound residue represented by the general formula 1 or 2 is included as a constituent component. (2) The acid value (unit: equivalent/10 6 g) is 50 or more and 1000 or less. (3) Urethane group concentration (unit: equivalent / 10 6 g) is 100 or more and 600 or less. (R1 and R2 are each independently a hydrogen atom or a hydrocarbon group, R3 and R4 are each independently a hydrogen atom, a hydrocarbon group, or a hydroxy group-substituted hydrocarbon group, and l and m are integers of 0-4.) (R5 is a hydrogen atom or a hydrocarbon group, and R6 and R7 are each independently a hydrogen atom, a hydrocarbon group, or a hydroxy group-substituted hydrocarbon group.) |