| abstract |
To provide a polycarbonate-imide resin paste that satisfies (1) non-nitrogen solvent solubility, (2) low warpage, and (3) flex resistance at the same time, applicable as a solder resist layer, a surface protective layer, or an adhesive layer. [Solution] Constituents represented by specific structural formula (1), constituents represented by specific structural formula (2), and constituents represented by specific structural formula (3), and the total constituents are 200 mol% , The constituent component represented by the specific structural formula (1) is 10 mol% or more, the constituent component represented by the specific structural formula (2) is more than 30 mol% and less than 70 mol%, and the constituent component represented by the specific structural formula (3) is Polycarbonate imide resin (A), characterized in that more than 50 mol%. |