| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-013 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-322
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-125
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-101
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41M5-0017 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-101
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-322 |
| filingDate |
2017-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2021-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2021-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-102232350-B1 |
| titleOfInvention |
Solder mask inkjet inks for manufacturing printed circuit boards |
| abstract |
The present invention provides an inkjet method for manufacturing a solder mask in manufacturing a printed circuit board. By using a solder mask inkjet ink containing at least one photoinitiator, at least one free radical polymerizable compound and at least one RAFT compound as adhesion promoter, it withstands high thermal stress during the soldering process while maintaining excellent physical properties. High quality solder masks can be produced. |
| priorityDate |
2016-11-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |