| abstract |
It relates to an epoxy composition, a composite thereof, and an article including the same, in which the reactivity of the epoxy resin having an alkoxysilyl group is improved by a specific acrylic polymer resin. According to the present invention, an epoxy resin having an alkoxysilyl group, an acrylic polymer resin, an epoxy composition including an inorganic filler, a composite thereof, and an article including the same are provided. The epoxy composition of the present invention exhibits excellent thermal expansion resistance in a composite, and can be used for packaging of semiconductor devices and/or manufacturing electrical and electronic components. |