http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102231993-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4652 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-429 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-382 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 |
| filingDate | 2019-03-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-102231993-B1 |
| titleOfInvention | Manufacturing method of multilayer wiring board |
| abstract | There is provided a method for manufacturing a multilayer wiring board, which is excellent in circuit adhesion and capable of very effectively preventing penetration of an inner layer circuit by laser processing. The manufacturing method of this multilayer wiring board includes (a) a step of sequentially laminating a first insulating layer and a second metal foil on a first metal foil to form a first laminate, and (b) a step of forming a second wiring layer, (c) a step of sequentially stacking a second insulating layer and a third metal foil to form a second laminate; (d) a step of forming a first via hole and a second via hole; and (e) a first wiring layer , A step of forming a multilayer wiring board including a second wiring layer and a third wiring layer, wherein a surface of the second metal foil facing at least the first insulating layer is measured by a Fourier transform infrared spectrophotometer (FT-IR). The reflectance of the laser having a wavelength of 10.6 µm is 80% or more, and the peak density Spd of the peak measured in accordance with ISO25178 is 7000 pieces/mm 2 or more and 15000 pieces/mm 2 or less. |
| priorityDate | 2018-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 38.