| abstract |
A die bonding apparatus, a substrate bonding apparatus, a die bonding method, and a substrate bonding method capable of bonding a die to a substrate or bonding substrates without using bonding media such as an adhesion film and a solder bump are disclosed. do. A die bonding method according to an embodiment of the present invention is a die bonding method of bonding a die onto a substrate, the method comprising: hydrophilizing a bonding surface of the die to be bonded onto the substrate by plasma treatment; Supplying a liquid containing water to a bonding area on the substrate to be bonded to the die to form a liquid film on the bonding area; Temporarily bonding the die on the substrate by contacting the die on the liquid film and bonding the die to the liquid film by a bonding force between the hydrophilized bonding surface of the die and the liquid film; And performing heat treatment in a state in which one or more dies are temporarily bonded to the substrate to simultaneously bond the one or more dies to the substrate. |