| abstract |
An object of the present invention is to form a conductive pattern having high dispersion stability and low resistance on a substrate. The dispersion (1) contains copper oxide (2), a dispersant (3), and a reducing agent, the content of the reducing agent is within the range of the following formula (1), and the content of the dispersant is within the range of the following formula (2). 0.0001 ≤ (reducing agent mass/copper oxide mass) ≤ 0.10 (1) 0.0050 ≤ (dispersant mass/copper oxide mass) ≤ 0.30 (2) When the reducing agent is included, the reduction of copper oxide to copper during firing is promoted, and sintering of copper is promoted. |