http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102224210-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-005 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-035 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3171 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D183-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D7-70 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D7-61 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 |
| filingDate | 2016-08-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-03-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-03-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-102224210-B1 |
| titleOfInvention | Semiconductor device, and semiconductor element protection material |
| abstract | Provided is a semiconductor device capable of excellent heat dissipation of a cured product, less voids of a cured product, excellent insulation reliability of a cured product, and good protection of semiconductor elements. A semiconductor device according to the present invention includes a semiconductor element and a cured product disposed on a first surface of the semiconductor element, and the material for protecting a semiconductor element for obtaining the cured product includes a thermosetting compound, a curing agent or a curing catalyst, and , Containing an inorganic filler having a thermal conductivity of 10 W/m·K or more, and does not contain a cyclic siloxane compound from a trimer to a decomer, or contains 500 ppm or less of a cyclic siloxane compound from a trimer to a decer, The content of the inorganic filler in the cargo is 60% by weight or more and 92% by weight or less, and the electric conductivity of the cured product is 50 µS/cm or less. |
| priorityDate | 2015-08-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 188.