| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-568
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-04105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-96 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53295
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5329
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-532
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-561
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-07 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-532
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 |
| filingDate |
2017-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2021-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2021-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-102216172-B1 |
| titleOfInvention |
Method for manufacturing insulating film and semiconductor package |
| abstract |
The present invention provides an insulating layer manufacturing method capable of minimizing the degree of warpage due to shrinkage of a polymer during curing and securing stability of a semiconductor chip located therein, and a semiconductor package manufacturing method using an insulating layer obtained from the insulating layer manufacturing method. It's about how. |
| priorityDate |
2017-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |