| abstract |
A polyimide precursor useful for the production of a polyimide film having a colorless transparency, low residual stress generated between the inorganic film and excellent mechanical properties and thermal properties. The polyimide precursor is the following formula (A): It is obtained from a monomer component containing a diamine represented by, and the following general formula (B): In the formula, a plurality of R 3 and R 4 are each independently a monovalent organic group having 1 to 20 carbon atoms, and h is an integer of 3 to 200 as a polyimide precursor having a structural unit represented by heat curing In the case where it is made, it has at least one glass transition temperature in a temperature range of 150°C to 380°C, no glass transition temperature in a temperature range of 0°C to 150°C (not including both ends), and the imide group concentration It is characterized in that the polyimide resin which may contain a solvent that is 2.00 to 3.70 mmol/g is obtained. |