| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0401
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-02351
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-02125
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13111
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05567
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05572
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1607
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05551
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05552
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05557
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16106
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16258
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3512 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-62 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-62 |
| filingDate |
2014-08-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2021-02-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2021-02-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-102212559-B1 |
| titleOfInvention |
Semiconductor light emitting diode and semiconductor light emitting diode package using the same |
| abstract |
The present invention includes a light emitting diode chip having a first surface on which first and second electrodes are disposed and a second surface opposite to the first surface; A passivation layer disposed on the surface of the LED chip to expose bonding regions of the first and second electrodes; A plurality of solder pads disposed on the bonding areas and each having a plurality of separated areas; Including a plurality of solder bumps disposed on the bonding regions, each covering the separated plurality of regions of the solder pad, it is possible to effectively block separation due to damage to the interface between the solder pad and the solder bump. |
| priorityDate |
2014-08-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |