http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102210371-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-17 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 |
| filingDate | 2014-07-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-01-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-01-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-102210371-B1 |
| titleOfInvention | Resin compositions for sealing semiconductor and semiconductor device with the cured product thereof |
| abstract | An object of the present invention is to provide a resin composition that provides a cured product having less thermal decomposition (weight reduction), excellent mechanical strength at high temperature, and excellent insulating properties even when placed under a high temperature of 200°C or higher for a long period of time. The present invention, (A) a cyanate ester compound having two or more cyanato groups in one molecule; (B) inorganic filler; (C) a silane coupling agent having a group represented by a primary amine, a secondary amine, a tertiary amine, or -N=CR 2 (R is a monovalent hydrocarbon group) at the terminal; And (D) Provides a composition comprising at least one compound selected from an amine compound other than the component (C), a phenol compound, a phosphine compound, and an adduct of a phosphine compound and a quinone compound. |
| priorityDate | 2013-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 203.