http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102193485-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-58 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-58 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 |
| filingDate | 2013-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2020-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2020-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-102193485-B1 |
| titleOfInvention | Copper plating bath composition |
| abstract | The present invention relates to aqueous acidic plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention contains copper ions, at least one acid, and a ureylene polymer containing amino residues at both ends and not containing an organic binding halogen. The plating bath fills the groove structures with copper and is particularly useful for the build-up of filler bump structures. |
| priorityDate | 2012-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 79.