| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-285
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0366 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L97-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3452
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L33-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-285
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L33-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L33-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L101-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L97-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0366 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L33-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L97-02 |
| filingDate |
2014-04-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2020-12-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2020-12-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-102192598-B1 |
| titleOfInvention |
Printed-circuit-board material and printed circuit board using same |
| abstract |
The present invention provides a printed wiring board material that is less likely to cause smear on the upper surface of a metal foil such as copper and is easily removed even if it occurs, and a printed wiring board using the same. The printed wiring board material contains a binder component, cellulose nanofibers having a number average fiber diameter of 3 nm to 1000 nm, and an acrylic copolymer compound, and can be suitably used for solder resists and interlayer insulating materials for multilayer printed wiring boards. The printed wiring board uses this printed wiring board material. |
| priorityDate |
2013-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |