http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102188813-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-1623 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-1607 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-1609 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-14201 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-1621 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B41J2-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B41J2-16 |
| filingDate | 2015-04-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2020-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2020-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-102188813-B1 |
| titleOfInvention | B-stage film adhesive compatible with aqueous ink for printhead structures interstitial bonding in high density piezo printheads fabrication for aqueous inkjet |
| abstract | The inkjet printhead forming method includes an epoxy adhesive treatment step to reduce or eliminate negative effects due to physical contact with specific inks. Conventional adhesives treated in a conventional method are known to cause weight gain and extrusion when exposed to certain inks such as ultraviolet inks, solid inks, and aqueous inks. Embodiments of the present invention include specific adhesive treatment steps such that the formed epoxy adhesive is suitable for printhead applications. |
| priorityDate | 2014-04-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 26.