http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102187518-B1
Outgoing Links
Predicate | Object |
---|---|
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4064 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-223 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-32 |
filingDate | 2019-08-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2020-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2020-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | KR-102187518-B1 |
titleOfInvention | Epoxy resin composition |
abstract | The present invention cures even under low temperature conditions in a short time, has a low glass transition point (T g ), and provides a cured product in which T g hardly changes even after a long time elapses after curing, a sealing material comprising the same, and curing it It relates to a cured product obtained by making it, and an electronic component including the cured product. The epoxy resin composition of the present invention, a low T g, the T g is, since a long time has passed even provide a cured product that does not substantially change after curing, it is useful as an adhesive for semiconductor devices and electronic parts, sealing materials, daemje like. |
priorityDate | 2019-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 217.