http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102186998-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31511 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31504 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31721 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31663 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-265 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31855 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3121 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-561 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-97 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 |
| filingDate | 2014-07-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2020-12-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2020-12-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-102186998-B1 |
| titleOfInvention | Substrate containing sealing material for sealing semiconductor, semiconductor device, and method for manufacturing semiconductor device |
| abstract | An object of the present invention is to provide a sealing material with a substrate for semiconductor encapsulation, which makes it possible to manufacture a semiconductor device having excellent appearance and laser marking properties, and a method for manufacturing the semiconductor device and the semiconductor device. The sealing material with a substrate for semiconductor encapsulation of the present invention is a sealing material with a substrate for semiconductor encapsulation for collectively sealing an element mounting surface of a semiconductor element mounting substrate having a semiconductor element mounted thereon or an element formation surface of a semiconductor element forming wafer having a semiconductor element formed thereon, It is characterized by having a substrate, a sealing resin layer comprising an uncured or semi-cured thermosetting resin formed on one surface of the substrate, and a surface resin layer formed on the other surface of the substrate. |
| priorityDate | 2013-07-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 149.